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 FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
August 2007
FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Features
1.2 to 5.5V Input Voltage Range Typical RDS(ON) = 50m @ VIN = 5.5V Typical RDS(ON) = 55m @ VIN = 3.3V ESD Protected, above 2000V HBM
tm
General Description
The FPF1005 & FPF1006 are low RDS P-Channel MOSFET load switches with CMOS controlled turn-on targeting small package load switch applications. The input voltage range operates from 1.2V to 5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signals. In FPF1006, 120 on-chip load resistor is added for output quick discharge when switch is turned off. Both FPF1005 & FPF1006 are available in a small 2X2 MicroFET-6 pin plastic package.
Applications
PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies RoHS Compliant
PIN 1
BOTTOM
TOP
Typical Application Circuit
TO LOAD VIN VOUT
FPF1005/6 CIN OFF ON ON GND COUT
Ordering Information
Part
FPF1005 FPF1006
Switch
55m, PMOS 55m, PMOS
Input Buffer
Schmitt Schmitt
Output Discharge
NA 120
ON Pin Activity
Active HI Active HI
(c)2007 Fairchild Semiconductor Corporation FPF1005-FPF1006 Rev. G
1
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Functional Block Diagram
VIN Turn-On Slew Rate Controlled Driver CONTROL LOGIC
ON
ESD protection VOUT
FPF1005/6
Output Discharge (Optional)
GND
Pin Configuration
GND 6 VOUT 5 VOUT 4 7 GND
1 ON 2 VIN 3 VIN
MicroFET 2x2 6L BOTTOM
Pin Description
Pin
4, 5 2, 3 6, 7 1
Name
VOUT VIN GND ON
Function
Switch Output: Output of the power switch Supply Input: Input to the power switch and the supply voltage for the IC Ground ON/OFF Control Input
FPF1005-FPF1006 Rev. G
2
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Absolute Maximum Ratings
Parameter
VIN, VOUT, ON to GND Maximum Continuous Switch Current Power Dissipation @ TA = 25C (Note 1) Operating Temperature Range Storage Temperature Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM MM 2000 200 -40 -65
Min
-0.3
Max
6 1.5 1.2 85 150 86
Unit
V A W C C C/W V V
Recommended Operating Range
Parameter
VIN Ambient Operating Temperature, TA
Min
1.2 -40
Max
5.5 85
Unit
V C
Electrical Characteristics
VIN = 1.2 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C.
Parameter
Basic Operation Operating Voltage Quiescent Current Off Supply Current Off Switch Current
Symbol
VIN IQ IQ(off) ISD(off)
Conditions
Min
1.2
Typ
Max
5.5 1 1 1
Unit
V A A A nA
IOUT = 0mA, VIN = VON VON = GND, OUT = open VON = GND, VOUT = 0V @ VIN = 5.5V, TA = 85C VON = GND, VOUT = 0V @ VIN = 3.3V, TA = 25C VIN = 5.5V, TA = 25C VIN = 3.3V, TA = 25C VIN = 1.5V, TA = 25C VIN = 1.2V, TA = 25C VIN = 3.3V, VON = 0V, TA = 25C, FPF1006 VIN = 5.5V VIN = 4.5V VIN = 1.5V VIN = 5.5V 2.00 1.75 0.75 -1 10 50 10 10 100 10 10 50 55 95 165 75
100 70 80 135 250 120 1.25 1.10 0.50
On-Resistance
RON
m
Output Pull Down Resistance ON Input Logic Low Voltage
RPD VIL
V
ON Input Logic High Voltage ON Input Leakage Dynamic Turn on delay
VIH
VIN = 4.5V VIN = 1.5V VON = VIN or GND
V 1 A s s s s s s
tON
VIN = 3.3V, RL = 500, CL = 0.1F, TA = 25C VIN = 3.3V, RL = 500, CL = 0.1F, TA = 25C, FPF1005 VIN = 3.3V, RL = 500, CL = 0.1F, RL_CHIP = 120, TA = 25C, FPF1006 VIN = 3.3V, RL = 500, CL = 0.1F, TA = 25C VIN = 3.3V, RL = 500, CL = 0.1F, TA = 25C, FPF1005 VIN = 3.3V, RL = 500, CL = 0.1F, RL_CHIP = 120, TA = 25C, FPF1006
Turn off delay
tOFF
VOUT Rise Time
tR
VOUT Fall Time
tF
Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board
FPF1005-FPF1006 Rev. G
3
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
10
2.5
8 SUPPLY CURRENT (nA)
2.0 ON THRESHOLD (V)
MAX LIMIT
6
1.5
TYPICAL
4
VON = VIN
1.0
2 VON = 0V 0 1 2 3 4 5 6 7 SUPPLY VOLTAGE (V) 8 9 10
0.5
0.0 1 2 3 4 SUPPLY VOLTAGE (V) 5 6
Figure 1. Quiescent Current vs.VIN
Figure 2. ON Threshold vs. VIN
16 14 SUPPLY CURRENT (nA)
SUPPLY CURRENT (nA)
10
12 10 8
VIN = 5.5V
8
6
VIN = 5.5V
6 4 2
VIN = 3.3V
4
2
VIN = 3.3V
0 -40
0
-15
10 35 60 TJ, JUNCTION TEMPERATURE (oC)
85
-40
-15
10 35 60 o TJ, JUNCTION TEMPERATURE ( C)
85
Figure 3. Quiescent Current vs. Temperature
Figure 4. Quiescent Current (off) vs. Temperature
800 700 SUPPLY CURRENT (nA) 600 500 400 300 200 100 0 -50 -25 0 25 50 75 o TJ, JUNCTION TEMPERATURE ( C) 100
VIN = 3.3V
100 90 SUPPLY CURRENT (nA)
VIN = 5.5V
80 70 60 50 40 30 20 10 0 1 2 3 4 SUPPLY VOLTAGE (V) 5 6
Figure 5. ISWITCH-OFF Current vs. Temperature
Figure 6. ISWITCH-OFF Current vs. VIN
FPF1005-FPF1006 Rev. G
4
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
400
IOUT = 1A
1.5
VIN = 3.3V IOUT = 1A
350 ON RESISTANCE (mOhms) 300 250 200 150 100 50 0 0 1 2 3 4 5 SUPPLY VOLTAGE (V) 6 7
1.3 RON NORMALIZED
1.1
0.9
0.7
0.5 -50
-25
0 25 50 75 o TJ, JUNCTION TEMPERATURE ( C)
100
Figure 7. RON vs. VIN
Figure 8. RON vs. Temperature
100
VIN = 3.3V RL = 500 RL_CHIP = 120, FPF1006 FPF1005 TOFF
1000
VIN = 3.3V RL = 500 RL_CHIP = 120, FPF1006 CL = 0.1uF FPF1005 TFALL
TURN ON/OFF TIME (uS)
RISE / FALL TIME (uS)
CL = 0.1uF
100
TRISE
10
FPF1006 TFALL
FPF1006 TOFF
TON
10 -50 -25 0 25 50 75 o TJ, JUNCTION TEMPERATURE ( C) 100
1 -50 -25 0 25 50 75 o TJ, JUNCTION TEMPERATURE ( C) 100
Figure 9. TON/TOff vs. Temperature
Figure 10. TRISE/TFALL vs. Temperature
VON 2V/DIV
VIN = 3.3V CIN = 1F COUT = 0.1F RL = 500
VON 2V/DIV
VIN = 3.3V CIN = 1F COUT = 0.1F RL = 500
IOUT 10mA/DIV
IOUT 10mA/DIV
VOUT 2V/DIV 50s/DIV Figure 11. FPF1005 TON Response
VOUT 2V/DIV 50s/DIV Figure 12. FPF1005 TOFF Response
FPF1005-FPF1006 Rev. G
5
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
VON 2V/DIV
VON 2V/DIV
IOUT 200mA/DIV VIN = 3.3V CIN = 1F COUT = 0.1F RL = 10
IOUT 200mA/DIV VIN = 3.3V CIN = 1F COUT = 0.1F RL = 10
VOUT 2V/DIV
VOUT 2V/DIV
50s/DIV Figure 13. FPF1005 TON Response
5s/DIV Figure 14. FPF1005 TOFF Response
VON 2V/DIV
VIN = 3.3V CIN = 1F COUT = 0.1F RL = 500
VON 2V/DIV
VIN = 3.3V CIN = 1F COUT = 0.1F RL = 500
IOUT 10mA/DIV
IOUT 10mA/DIV
VOUT 2V/DIV 50s/DIV Figure 15. FPF1006 TON Response
VOUT 2V/DIV
50s/DIV Figure 16. FPF1006 TOFF Response
VON 2V/DIV
VON 2V/DIV
IOUT 200mA/DIV VIN = 3.3V CIN = 1F COUT = 0.1F RL = 10
IOUT 200mA/DIV VIN = 3.3V CIN = 1F COUT = 0.1F RL = 10
VOUT 2V/DIV
VOUT 2V/DIV
50s/DIV Figure 17. FPF1006 TON Response
5s/DIV Figure 18. FPF1006 TOFF Response
FPF1005-FPF1006 Rev. G
6
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Description of Operation
The FPF1005 & FPF1006 are low RDS(ON) P-Channel load switches with controlled turn-on. The core of each device is a 55m P-Channel MOSFET and a controller capable of functioning over a wide input operating range of 1.2-5.5V. The ON pin, an active HI TTL compatible input, controls the state of the switch. The FPF1006 contains a 120 on-chip load resistor for quick output discharge when the switch is turned off. However, VOUT pin of FPF1006 should not be connected directly to the battery source due to the discharge mechanism of the load switch.
Application Information
Typical Application
VIN VIN = 3.3V CIN
VOUT
FPF1005/6
OFF ON VON = 3.3V ON GND
RL
COUT
-
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1F ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop during higher current application.
Output Capacitor
A 0.1F capacitor, COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductance from forcing VOUT below GND when the switch turns-off. Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON and GND) will help minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance.
FPF1005-FPF1006 Rev. G
7
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
Evaluation Board Layout
FPF1005/6 Demo board has the components and circuitry to demonstrate the load switch functions. Thermal performance of the load switch can be improved significantly by connecting the middle pad (pin 7) to the GND area of the PCB.
Figure 19. Demo board silk screen top and component assembly drawing.
Figure 20. Demo board top and surface mount top layers view.(Pin 7 is connected to GND).
Figure 21. Demo board bottom layer view.
Dimensional Outline and Pad Layout
NOTES: A. NON-CONFORMS TO JEDEC REGISTRATION. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
FPF1005-FPF1006 Rev. G
8
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FPF1005-FPF1006 IntelliMAXTM Advanced Load Management Products
TRADEMARKS
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx(R) Build it NowTM CorePLUSTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FPSTM FRFET(R) Global Power ResourceSM Green FPSTM Green FPSTM e-SeriesTM GTOTM i-LoTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R)
(R)
PDP-SPMTM Power220(R)
Power247(R) POWEREDGE(R) Power-SPMTM PowerTrench(R) Programmable Active DroopTM QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6
SuperSOTTM-8 SyncFETTM The Power Franchise(R)
TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM SerDesTM UHC(R) UniFETTM VCXTM
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I31
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
FPF1005-FPF1006 Rev. G
9
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